Encapsulation électronique

Electronic encapsulation

Electronic encapsulation & coating

Potting, resin-coating & overmolding

We offer a comprehensive solution, from design to manufacture, for all your electronic encapsulation requirements, including coating, potting, resin-coating and low-pressure overmolding.

Drawing on our extensive experience, the SYNERGICA team is able to support you in defining your requirements, industrializing them and then mass-producing your products. We play an active role alongside you in defining the most appropriate electronic coating for your product's constraints and environment: choice of resins, overmolding, etc.

Through a demanding manufacturing process and strict quality control, we realize “potting” and coating components for demanding industries: heating, petrochemicals, nautical, lighting (Led), probes, electronics, etc.

We can deliver finished or semi-finished products and directly connect them to the connector, cable or electrical harness.

Encapsulation by resin-coating or potting

Why resin-coat an electronic circuit?

Resin encapsulation, or more commonly potting, involves applying a resin to an electronic assembly, component or board to provide it with additional properties:

Sealing. Once hardened, the resin provides effective protection for electronic circuits operating in harsh environments: humidity, chemicals, salt spray, electronic components operating in submerged environments, etc.
Inviolability. The use of an opaque encapsulation resin can both protect and mask an electronic component or circuit. The use of polyurethane and epoxy resins ensures very strong adhesion between the circuit and the resin, making them particularly difficult to separate.
Resistance. Coating effectively protects a product against vibration and shock. By using flexible resins, the product is able to absorb shocks. This resin also prevents shocks from being directly reflected on its components
Thermal protection : potting enables better dissipation of the heat induced by the joule effect of an electronic circuit. The resin thus acts as a heat sink. On the other hand, some resins, such as silicone resins, provide good protection against thermal shock by attenuating it. This extends component life by reducing thermal stress. The operating ranges of these resins are particularly suitable, from -45°C (-49°F) to +200°C (392°F) or even 250°C (482°F) when loaded with iron oxide.

Our resins

What resins do we use?

We work with polyurethane (PU), epoxy, silicone and UV-curing polyacrylate resins. We master the resin polymerization process at industrial level to meet the most demanding quality requirements.

On a daily basis we use:

Silicone resins: for encapsulating high-temperature probes and sensors
Two-component resins: Polyurethane (PU), Epoxy
UV-curing resins

Our factories are equipped with the latest equipment to meet your needs, including static mixers for two-component resins, compressed-air dosing units and exposure tunnels for optimum control of resin polymerization.

Overmolding encapsulation

Low-pressure overmolding

Overmolding encapsulation is used to reinforce electronic boards, components or assemblies operating in harsh environments.

Low-pressure overmolding involves injecting a thermoplastic at a pressure of between 2 and 10 bars. This low pressure prevents damage to electrical or electronic components.

The molds used are made of aluminum, making them more economical. Low pressure means no damage to electrical or electronic components.

Like other types of encapsulation, it protects electronic components from heat, dust, shocks, corrosive and harsh environments, and humidity.

Resin-coating or overmolding ?

Which solution for which use?

Resin-coating (resin casting) doesn't require a mold, just a case. It is therefore preferable when production runs are small. Even if certain areas can be spared, the part must be relatively simple for resin-coating to be possible. It is possible to cast a multitude of different resins: silicone, epoxy, polyurethane.... After casting, the buried components are sealed tamper-proof.

In low-pressure overmolding, the parts can be more complex and smaller. This operation requires the creation of a mold mounted on a press, which in turn requires larger production runs in order to amortize the tool. Materials are more limited. These are mainly polyamide and polypropylene resins known as hotmelt.

Please do not hesitate to contact our technical teams directly, so that we can help you draw up your specifications and produce your overmolded or resin-coated products.